Empowering Next-Generation Semiconductorswith Advanced Plating.
Equipment used by Kiyokawa Plating Industries Co, Ltd.
Revolutionizing Powder Materialswith Nano Plating Technology.
Examples of materials used by Kiyokawa Plating Industries Co, Ltd.
Plating Quality Made in Japan, Trusted Worldwide.
Staff of Kiyokawa Plating Industries Co, Ltd.
 

Our Services

  • Electrolytic UBM Plating: Bumps & Lines

    Optimize your semiconductor designs with our high-precision solder bump electroplating and micro-wiring solutions for wafer applications.

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  • TSV & TGV Via Plating

    Discover our advanced via filling plating technology for wafers and glass, perfect for 3D packaging, miniaturization, and high-density integration.

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  • Electroless UBM Plating for Power Devices

    Find reliable electroless UBM plating solutions for semiconductor bonding, ideal for automotive, power devices, and high-performance applications.

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  • Plating on Powdered Materials

    Enhance your materials with advanced powder plating for better conductivity, corrosion resistance, and electromagnetic shielding.

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Explore More Plating Solutions

Our Japanese website features a wide range of advanced plating technologies and application examples for
Medical Devices, Electronic Components, Substrates, Magnets, and other specialized industries.
Most modern browsers can automatically translate these pages into your preferred language.

Learn More（Japanese website)

Quality Assurance

At Kiyokawa, we ensure rigorous quality control in plating, leveraging years of experience in mechanical, electronic, semiconductor, and medical parts with advanced nano-level analysis.

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About  KIYOKAWA

Learn about Kiyokawa Plating Industries' corporate philosophy, history, and dedication to quality, innovation, and environmental sustainability.

About us
Sustainability

Resource

 

News

Thank You for Visiting Us at SEMICON Taiwan 2026

KIYOKAWA PLATING INDUSTRY CO., LTD. exhibited at SEMICON Taiwan 2026 , held in Taipei from September 2–4, 2026, in cooperation with Sumitronics Taiwan Co., Ltd.

This was our first overseas exhibition , and we were delighted to welcome many visitors from Taiwan and around the world to our booth.

We showcased our advanced plating technologies, including /TGV Cu filling, fine bump and RDL plating, electroless UBM, selective plating for thermal management, and powder plating.

We would like to sincerely thank everyone who visited our booth and shared valuable discussions with us.

KIYOKAWA will continue to provide advanced plating solutions from Japan to customers worldwide.

SEMICON Taiwan 2026

Your unique plating solution starts here.

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