Optimize your semiconductor designs with our high-precision solder bump electroplating and micro-wiring solutions for wafer applications.
Discover our advanced embedding plating technology for vias in wafers and glass, perfect for 3D packaging, miniaturization, and high-density integration.
Find reliable electroless UBM plating solutions for semiconductor bonding, ideal for automotive, power devices, and high-performance applications.
Enhance your materials with advanced powder plating for better conductivity, corrosion resistance, and electromagnetic shielding.
At Kiyokawa, we ensure rigorous quality control in plating, leveraging years of experience in mechanical, electronic, semiconductor, and medical parts with advanced nano-level analysis.
Learn about Kiyokawa Plating Industries' corporate philosophy, history, and dedication to quality, innovation, and environmental sustainability.
