KIYOKAWA PLATING INDUSTRY CO., LTD. is pleased to announce that we will jointly exhibit with Sumitronics Taiwan Co., Ltd. at SEMICON Taiwan 2026, taking place September 2–4.
At our booth, KIYOKAWA will showcase its latest plating technologies under the theme:
Advanced Plating for AI Thermal Management, Semiconductor Packaging & Functional Materials
Featured technologies include:
- Void-Free Cu Filling for TSV/TGV
For Si, SiC and glass substrates, including high-aspect-ratio vias - Fine Bump, Pillar & RDL Plating
Integrated processing from seed formation to stripping, up to 12-inch wafers - Electroless UBM & Thick Cu Plating
For bonding, high-current and thermal applications - Selective Plating for Thermal Management Components
For Al and Cu heat-dissipation substrates used in automotive power semiconductors and liquid-cooling components for AI servers - Powder Plating for New Material Development
Creating new functionality by combining various powders with plated metals - nanoZAC® Dendritic Metal Powders
High-purity, high-surface-area and low-density metal powders for conductive and catalytic applications
From a single prototype to mass production, KIYOKAWA provides flexible support for challenging plating requirements.
Have a plating challenge that conventional processes cannot solve? Bring it to us.
SEMICON Taiwan 2026
September 2–4, 2026
Booth I2900
▶ View our SEMICON Taiwan Exhibitor Page
We look forward to welcoming you at our booth.
KIYOKAWA PLATING INDUSTRY CO., LTD. × Sumitronics Taiwan Co., Ltd.
