Request Free Resources ElWafer-Embedded Via Plating Technology (TSV/TGV)

TSV & TGV Via Plating

ElWafer-Embedded Via Plating Technology (TSV/TGV)
  • Void-Free Filling Plating Technology for TSV & TGV
  • Reducing the Burden of CMP Polishing
  • Compatibility with Various Via Shapes
  • Non-Destructive Inspection of Filling Status
  • Conformal Plating Technology
  • Differences Between Filling and Conformal Plating
  • Via Filling Plating Case Studies
  • Conformal Plating Case Studies
  • Supported Via Diameters and Depths

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