Accumulated Experience and Advanced Analytical Equipment
Leveraging our extensive experience in mechanical parts, electronic components, semiconductors, and the medical field, along with advanced analytical equipment capable of nanoscale analysis, we strive to deliver quality that exceeds our customers' expectations.
Quality Driven by Collaboration with Advanced Analytical Equipment
High-quality analysis results are made possible by combining the right analytical equipment with the expertise and judgment of skilled analysts. The advanced techniques and know-how gained through years of experience are what uphold the plating quality at Kiyokawa.
Automatic Titration Analyzer
ICP Optical Emission Spectrometer (ICP-OES)
Cross-Section Polisher™
Product Observation and Analysis
A variety of advanced instruments are used to observe and analyze product surfaces in great detail. These instruments allow for precise measurements of surface features, plating thickness, and elemental composition, ensuring the highest quality and consistency in Kiyokawa's products.
Digital Microscope
Used for visual observation, photography, and 2D/3D measurements of product surfaces.
Energy Dispersive X-ray Fluorescence (EDXRF) Analyzer
This instrument allows for qualitative and quantitative elemental analysis of materials, providing precise insights into their composition.
Energy Dispersive X-ray Fluorescence (EDXRF) for Plating Thickness Measurement
EDXRF is also utilized to accurately measure the thickness of plated coatings, ensuring consistency and reliability in product specifications.
Desktop SEM
Used for high-magnification observation of material surfaces, this microscope enables detailed inspection of microscopic features.
Scanning Electron Microscope (SEM)
SEM allows for high-resolution observation of material surfaces, providing crucial data for understanding surface structures and properties.
Energy Dispersive X-ray (EDX) Analyzer
Coupled with SEM, the EDX analyzer performs elemental qualitative and quantitative analysis in small regions, allowing for detailed compositional analysis at the microscopic level.
Wavelength Dispersive X-ray (WDX) Analyzer
Similar to the EDX, the WDX analyzer provides elemental analysis in small regions observed by SEM, but with higher resolution for certain applications.
Polishing Machine (Refinetech Model)
This machine is used for sample preparation, specifically for preparing cross-sections for detailed analysis.
Polishing Machine (IMT Model)
Another model used for sample preparation, ensuring smooth, well-prepared cross-sectional surfaces for further examination.
Cross-Section Polisher (CP)
This machine is specialized in preparing cross-sectional samples for in-depth analysis, especially in cases requiring precise material structure examination.
Liquid Component Analysis
Accurate analysis of liquid samples is essential in ensuring the correct formulation and quality control of plating solutions. These instruments help to analyze elemental composition, concentration of additives, and the overall chemical makeup of liquid samples to maintain consistent product quality.
Automatic Titration System
Automates titration processes, improving precision and efficiency in liquid analysis.
This instrument provides both qualitative and quantitative analysis of elements in liquid samples, making it ideal for detailed material composition studies.
Absorbance Spectrophotometer
Used for the quantitative analysis of substances in liquid samples, offering precise measurements of concentration.
CVS Analyzer (Metrohm Model)
Analyzes the concentration of additives in copper sulfate plating solutions, critical for ensuring consistent quality in electroplating processes.
CVS Analyzer (ECI Model)
Another model used for measuring additive concentration in copper sulfate plating solutions, ensuring accurate control over the plating process.
High-Performance Liquid Chromatograph (HPLC)
This system is used for separating and quantifying components in liquid samples, making it essential for detailed chemical analysis.
Capillary Electrophoresis (CE) Analyzer
Similar to HPLC, the CE analyzer is used for the separation and quantification of components in liquid samples, offering additional analytical capabilities.
Evaluation
Various evaluation methods ensure that Kiyokawa's products meet the necessary mechanical, surface, and environmental performance standards. These testing instruments assess everything from soldering properties to corrosion resistance, ensuring the longevity and reliability of plated materials.
Solder Wetting Tester
This instrument measures the wetting characteristics of ultra-fine electronic components, ensuring proper soldering properties.
Multi-Solder Tester
Used to evaluate the wetting properties of electronic components, ensuring optimal performance and quality in soldered joints.
Tensile Tester
This device evaluates the ductility and adhesion of plated coatings through tensile and peel tests, providing key data on the mechanical properties of the plating.
Contact Angle Goniometer
Used to assess the hydrophobic properties of material surfaces, crucial for evaluating the surface behavior of plated coatings.
Unsaturated Accelerated Life Test (PCT)
This testing apparatus accelerates the evaluation of the moisture resistance of electronic components and other materials, ensuring durability under environmental stress.
Salt Spray Test Chamber
This machine tests the corrosion resistance of plated materials, simulating real-world environmental conditions to ensure the durability of coatings.
Kiyokawa’s ISO 9001, ISO 14001, IATF 16949, and ISO/IEC 17025 certifications reflect our commitment to quality, environmental responsibility, and advanced testing. These certifications ensure our plating services are reliable, meet industry standards, and boost your product’s performance and sustainability.
Partnering with Kiyokawa means trusting our expertise to enhance your manufacturing, reduce environmental impact, and deliver consistent, exceptional results.
ISO 9001, ISO 14001
Kiyokawa was one of the first in the industry to receive ISO 9001 certification in 1994 and ISO 14001 certification in 1997. Additionally, we achieved a major milestone by being the first to receive the certification for the 2015 version update. Through the integration of management systems and business operations, we continue to build a strong track record.
Quality Assurance Standards
ISO 9001:2015 (Registered in February 1994)
Japan Quality Assurance Organization (JQA)
Design, development, and manufacturing of plating products
Environmental Standards
ISO 14001:2015 (Registered in November 1997)
Japan Quality Assurance Organization (JQA)
Design, development, and manufacturing of plating products, commissioned analysis
IATF 16949
We have obtained the quality management system certification specifically for the automotive industry, targeting automotive-related locations. Based on the system established through ISO 9001, we continue to pursue further quality improvement and customer satisfaction.
Automotive Industry Quality Standard
IATF 16949:2016 (December 2024)
Certified by DQS (German Quality System Certification)
Plating processing for semiconductors and electronic components
ISO / IEC 17025
Kiyokawa Chemical Research Institute achieved industry-first accreditation in 2008. Accredited test reports within the scope of certification can bear the accreditation symbol, ensuring international recognition. In addition to the management system for laboratory operations, it is essential to maintain technical proficiency, conduct performance comparisons with other laboratories, and uphold fairness and impartiality.
Laboratory Accreditation
ISO/IEC 17025:2017
Registered in February 2008 / Japan Accreditation Board (JAB)
Mechanical and Physical Testing, Chemical Testing
Details of Accredited Scope
Chemical Testing
Mechanical and Physical Testing
Water Quality
Wastewater
Analysis of Metals in Wastewater
Tested Items
B,Cu,Zn,Pb,Cd,Mn,Fe,Ni,Sn,T-Cr
Test Method
JIS K 0102
Hazardous Substance Analysis
RoHS Analysis
Precise Analysis by ICP-OES
Tested Item
Hg
Test Method
IEC62321-4
Tested Items
Cd, Pb, Cr
Test Method
IEC62321-5
Hexavalent Chromium Determination
Tested Item
Cr (VI)
Test Method
IEC62321-7-1
Metal Surface Treatment
Plating Thickness
Microscopic Cross-Section Testing
Tested Item
Plating
Quantitative Range
1μm ≦ Thickness
Test Method
JIS H 8501 9
Fluorescent X-Ray Testing
Tested Items
Electroplated Products on Metal Substrates, Chemically Plated Products on Metal Substrates
Quantitative Range
Ni Plating : 1.729μm ≦ Thickness ≦ 9.20μm
Cr Plating : 0.020μm ≦ Thickness ≦ 0.083μm
Zn Plating : 2.41μm ≦ Thickness ≦ 21.7μm
Sn Plating : 1.155μm ≦ Thickness ≦ 9.41μm
Au Plating : 0.050μm ≦ Thickness ≦ 0.863μm
Test Method
JIS H 8501 13
Corrosion Resistance Testing
Neutral Salt Spray Test
Tested Item
Plated and Plated Products
Test Method
JIS H 8502 7.1, JIS Z 2371
Ferroxyl Test (Qualitative)
Tested Items
Copper-Nickel Plating on Steel Substrates.
Nickel-Chromium Plating on Steel Substrates.
Copper-Nickel-Chromium Plating on Steel Substrates.
Nickel Plating on Steel Substrates.
Electroless Nickel-Phosphorus Plating on Steel Substrates.
Test Method
JIS H 8617 Appendix 3, JIS H 8626 Appendix 1, JIS H 8645 Appendix 5 3.1
Adhesion Testing
Tape Testing Method
Tested Item
Electroplated and Chemically Plated Products on Metal Substrates
Test Method
JIS H 8504 15.1
Chromate Coating
Qualitative Hexavalent Chromium Test
Tested Item
Chromate Coating on Electrogalvanized Plating
Determination Method
Spot Test Method
Test Method
JIS H 8625 Appendix 2 3.2
Quantitative Hexavalent Chromium Test
Tested Item
Chromate Coating on Electrogalvanized Plating
Quantitative Method
Diphenylcarbazide Absorption Photometry
Quantitative Range
0.0001mg/cm² ≦ Cr (VI)
Test Method
JIS H 8625 Appendix 2 4.1
Measurement Certification Facility
Registered for the "Concentration of Substances in Water or Soil" category. Measurement results in this category can be certified with a measurement certificate. We mainly conduct analysis of factory wastewater.
If you have any concerns or need advice on plating, trust us at the Plating Clinic. With our advanced analysis technology and expertise, we’re ready to support you. In manufacturing, challenges like quality evaluation, defect prevention, and improvement are common. We treat your products with the same care and are here to help you find solutions. Don’t hesitate to reach out for assistance.
Quality and Environmental Policy
Reference Number: KPNCOMC-00-003(R16)
At Kiyokawa Plating Industries Co., Ltd., guided by our corporate philosophy, "The result of free creativity opens a great future," we focus on activities that contribute to the well-being of our stakeholders and the safety of society.
Our top priority is zero defects.
We work to enhance customer satisfaction by meeting quality standards and other agreed requirements, while complying with environmental laws and regulations.
We strive for a sustainable society
by conserving resources and saving energy, driven by the miniaturization of products using our proprietary nano-plating technology.
We are committed to reducing CO2 emissions and water usage
through energy-saving and production efficiency improvements.
These efforts reflect our dedication to continuous improvement in both quality and environmental management, enhancing overall performance. This policy will be shared with all employees and made available on our website.
Hajime Kiyokawa
President and CEO, Kiyokawa Plating Industries Co., Ltd.
