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UBM Plating Technology for Semiconductor Wafer

We challenge the dream of next generation in Nano Plating Technology!!

Auto Electro-less plating Equipment

UBM+Forming Solder Bump

We take away the forming solder bump as an example.
Could you contact it about detail ?

Evaluation Data

Unique Technology

World First Technology: Plating on 0.7um powder

Plating for powder

Electroforming Technology

Ultra-water-rcpellent plating

Green engineering

We develop reliable battery materials at the large capacity that I made use of nano-plating technology of the Kiyokawa plating in as a cooperation study business of industry / a university / the administration of Fukui. We was able to raise the stability of the battery by having done special, uniform plating to electrode materials. We offer this sample to the battery maker by the end of 2008. And I aim at the practical use of less than 2 years.

Quality environmental policy


KIYOKAWA’S POLICY for Quality & Environment

Constant Efforts for Product Quality Improvement and Environmental Preservation and Protection, thereby Contributing to Community and Society.

It was certified both ISO9001,ISO14001 for the first time in the plating industry.